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Semprius Raises $4.1 Million First Financing Round

Wednesday, April 18, 2007 5:00:00 AM PDT | VentureDeal Staff
DURHAM, NC -- Semiconductor company Semprius Inc. announced the close of its first round of financing, securing $4.1 million in venture capital.

Semprius is commercializing a process for printing semiconductors on many types of surfaces, including plastic, glass and other materials.  The comopany said the funding will be used for product development and to hire additional business development personnel.

Investors in the round were Arch Venture Partners, InterSouth Partners and original investor Illinois Ventures.

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